Recent developments in the diamond industry project: signings finalized, with plans for R&D expansion!

Recently, domestically Diamond The industry sector is witnessing significant progress on several key projects, spanning materials research and development, production base construction, and intelligent manufacturing—reflecting the sector's growing momentum in high-end manufacturing and the expanding applications of new semiconductor materials.

        Total investment of 3 billion yuan! Xiamen CarbonSo Semiconductor New Materials Project Settles in Yangjiang, Guangdong

        On July 11, Yangjiang Binhai New Area (Yangjiang High-Tech Zone) officially signed an investment agreement with Xiamen Carbonso Investment Co., Ltd. for a semiconductor new-materials production base project. Liang Chongbian, Secretary of the Party Committee and Director of the Management Committee of Yangjiang Binhai New Area and Hailing Experimental Zone, along with Liang Yongjia, Deputy Director of the Management Committee, attended the signing ceremony.

Xiamen CarbonSuo Investment Co., Ltd. is a national high-tech enterprise whose core business focuses on the research, development, and manufacturing of advanced diamond materials. The company boasts a robust technological foundation in the innovative R&D and industrial application of synthetic diamond materials.

The project, which has just been signed and will be based in Yangjiang, boasts a total investment of 3 billion RMB, with fixed-asset investments amounting to 2.4 billion RMB. The project plans to construct a 33,000-square-meter production facility, complemented by an R&D center, production lines, and other essential infrastructure. The project’s primary product focus includes cultivation Diamonds , semiconductor-grade diamond substrates and Diamond tools 。

Once the project is completed and put into operation, it is expected to effectively drive the industrial development of Yangjiang Coastal New Area (Yangjiang High-Tech Zone) toward greater diversification and higher quality, injecting fresh momentum into the region's economy.

Sanan Optoelectronics launches R&D on fourth-generation semiconductor materials, including diamond.

        Leading compound semiconductor company Sanan Optoelectronics recently revealed significant developments in its new materials R&D through an investor interaction platform. Its subsidiary, Hunan Sanan, has officially kicked off research and development efforts on fourth-generation semiconductor materials such as gallium oxide (Ga₂O₃) and diamond.

This move marks the point at which Sanan Optoelectronics, having achieved phased success and established a solid foundation in the third-generation semiconductor materials field—primarily silicon carbide (SiC) and gallium nitride (GaN)—is now shifting its R&D resources toward the even more cutting-edge realm of ultra-wide-bandgap semiconductor materials.

Sanan Optoelectronics has established a relatively comprehensive industrial chain layout in the SiC field, developing vertically integrated capabilities that span from "materials (substrates) to epitaxial growth, chip manufacturing, and finally module packaging." Meanwhile, by partnering through joint ventures with leading global and domestic companies such as STMicroelectronics and Li Auto, the company has strengthened its market presence and fostered deeper technological collaboration.

According to disclosed information, as of April 2025, Hunan San'an has already established a monthly production capacity of 16,000 6-inch SiC substrates, along with the corresponding complementary epitaxial wafers. Additionally, its dedicated 8-inch SiC substrate production line, capable of manufacturing 1,000 wafers per month, has also been completed. Furthermore, in February of this year, San’an Optoelectronics and STMicroelectronics jointly established AnYiFahua Semiconductor, a company focused on automotive-grade chip production using an 8-inch wafer line that has now successfully started operations. This new production line is designed for an annual capacity of 480,000 wafers.

        San'an Optoelectronics' extensive manufacturing experience and core process technologies in the SiC field have provided crucial technical support and an industrial foundation for its expansion into the research and development of next-generation ultra-wide bandgap semiconductor materials such as gallium oxide and diamond.

        Hunan Yanling signs agreements for two major projects, including the intelligent mass production of diamond superhard grinding tools.

        On July 15 and 16, Hunan Yanling High-Tech Zone successfully signed agreements with two project partners, with a total investment reaching 552 million yuan.

        Project 1: Intelligent Mass Production Project for Polycrystalline Diamond Superhard Abrasives, with an investment of 216 million yuan.

        Project Two: High-Value Integrated Utilization of Rare Metal Materials, with an investment of 336 million yuan.

        These two projects are expected to create more than 100 new local jobs once they become operational. For Yanling High-Tech Zone, this signing is highly significant, as the projects will effectively complement and strengthen the zone's strategic industrial framework, particularly in its two flagship sectors: "synthetic diamond" and "rare metal materials." The successful implementation of these projects will accelerate the industry's transformation toward higher-end, smarter, and more sustainable production models, providing a fresh impetus for the region's economy to achieve even higher-quality growth. Notably, the intelligent mass-production project for polycrystalline diamond ultra-hard abrasives directly targets the advanced application of diamond materials in the industrial tools sector.

        Industry Background and Significance

        The concentrated implementation and R&D deployment of these projects highlight the growing importance and promising prospects of diamond materials in today’s industries.

In the semiconductor field, diamond—especially synthetic diamond—is regarded as a highly promising fourth-generation semiconductor material due to its naturally occurring highest hardness, exceptional thermal conductivity (far surpassing copper), exceptionally wide bandgap, outstanding carrier mobility, and superior radiation resistance. These unique properties make it invaluable for applications in high-temperature, high-frequency, and high-power electronic devices—such as power conversion systems and 5G/6G RF components—as well as in aerospace electronics and even emerging areas like quantum computing. Xiamen CarbonSoul is strategically positioning itself in Yangjiang to establish production of semiconductor-grade diamond substrates, squarely targeting this cutting-edge technological frontier.

        Consumer Sector (Lab-Grown Diamonds): Xiamen CarbonSoul Project has identified lab-grown diamonds as a key product, reflecting the growing market demand for these stones. Technological advancements have ensured that lab-grown diamonds match natural diamonds in both physical and chemical properties, while their eco-friendly attributes and relatively lower costs are reshaping the jewelry industry landscape.

        Ultra-hard materials Tools: The polycrystalline diamond superhard abrasive tools project in Yanling represents the development trend of this application branch. Diamond tools—such as abrasives, Cutting tools Drills, due to their ultra-hard and wear-resistant properties, are indispensable in fields such as precision machining, aerospace manufacturing, oil and gas exploration and extraction, and stone processing. Intelligent mass production aims to enhance manufacturing efficiency, ensure product consistency, and meet the stringent precision demands of high-end manufacturing.

        Conclusion

        The signing of Yangjiang's 3-billion-yuan semiconductor new-materials project, along with the successful establishment of two major projects in Yanling—totaling 552 million yuan (including intelligent diamond-tool production)—and San'an Optoelectronics' official launch of R&D into fourth-generation semiconductor materials like diamond, collectively paint a clear picture of China’s current diamond industry landscape: the industry is steadily expanding in scale, while its applications continue to shift toward high-value-added, high-tech segments—particularly advancing into cutting-edge semiconductor materials. At the same time, regional industrial clusters are increasingly taking shape, showcasing distinct paths of growth and specialization. These developments signal that China’s diamond industry is undergoing a critical transition—from relying on sheer scale advantages to embracing technology-driven leadership.