A seminar on diamond-based thermal packaging materials and devices was held in Xuchang.

To promote Diamond Class Heat dissipation On July 25, a seminar titled "Diamond-Based Thermal Management Materials and Devices: Technological Innovation and Industrial Applications" was grandly held in Xuchang. Hosted by the Xuchang Municipal Bureau of Industry and Information Technology, the Bureau of Science and Technology, and Xuchang Investment Group Co., Ltd., and organized by Henan Huanghe Whirlwind Co., Ltd., Suzhou Bozhijin Diamond Technology Co., Ltd., and Henan Qianyuanxin Diamond Semiconductor Technology Co., Ltd., the event brought together numerous industry experts, scholars, and business leaders. Together, they engaged in in-depth discussions and collaborations centered on cutting-edge technologies, market trends, and practical applications in the field of diamond-based thermal management materials and devices, collectively shaping the future roadmap for the diamond-based thermal solutions industry.

Xuchang Vice Mayor Yue Bangkui attended the meeting and delivered a speech. He emphasized that diamond-based thermal packaging materials, as an emerging key material, hold vast application potential across multiple fields—including electronics, communications, and energy. Xuchang is Ultra-hard materials The industry boasts a robust foundation, particularly in the field of diamond materials, where it enjoys significant industrial advantages and strong technological capabilities. The convening of this seminar is of great importance for Xuchang to further solidify and enhance its position in the ultra-hard materials sector, driving industrial upgrading and transformation. At the same time, we hope that this conference will attract more high-quality resources, fostering deeper integration among industry, academia, research, and application—allowing us to jointly tackle technical challenges and collectively advance the high-quality development of diamond-based thermal management packaging materials and devices.

During the technical seminar session, Associate Professor Wang Yanfeng, PhD supervisor at Xi'an Jiaotong University; Dr. Zhang Yongjian from Beijing University of Science and Technology; Nie Yuan, Senior Engineer at Chengdu Hongke Electronic Technology Co., Ltd.; and Professor Ma Shenglin from Xiamen University delivered a series of compelling presentations. The experts highlighted that diamond—a material renowned for its exceptionally high thermal conductivity, excellent electrical insulation properties, and low thermal expansion coefficient—holds tremendous potential in addressing the challenging issue of heat dissipation in high-power electronic devices. Thanks to ongoing advancements in synthesis techniques such as chemical vapor deposition (CVD), it is now possible to produce large-size, high-quality diamond-based thermal management materials. In their talks, the experts shared their latest research findings and practical insights from their respective fields, offering attendees cutting-edge technical knowledge and innovative perspectives.

During the new product launch event, Tan Zongwu, Deputy Director of the Industrial and Information Technology Bureau of Xuchang City; He Wei, Deputy Director of the Science and Technology Bureau of Xuchang City; Yang Zengjun, Chairman of Xuchang City Investment Group Co., Ltd.; Li Ge, Chairman, and Pang Wenlong, General Manager, of Henan Huanghe Whirlwind Co., Ltd.; and Pan Yuanzhi, General Manager of Suzhou Bozhijin Diamond Technology Co., Ltd., jointly unveiled the new product.

Huanghe Xuanfeng General Manager Pang Wenlong shared insights on the company’s CVD polycrystalline diamond film development project tailored for high-end application scenarios, as well as products like large-size wafers. Meanwhile, Bozhi Jinzuan General Manager Pan Yuanzhi discussed the research progress, technological breakthroughs, and potential applications of diamond-based semiconductor products.

It is reported that Qianyuan XinZui, a joint venture between Huanghe Xuanfeng and Bozhijin Zuan, has introduced a range of innovative products, including 6-inch and 8-inch MPCVD polycrystalline diamond wafers, single- and polycrystalline diamond packaging substrates, ultra-thin diamond film devices, and ultra-thin diamond heat sinks. Notably, the diamond-based heat-sink packaging substrates have successfully addressed key technical challenges such as large-scale substrate growth, surface treatment, and precision film deposition, enabling their engineering-scale application in high-power chips and devices.

The successful convening of this seminar on diamond-based thermal packaging materials and devices has established a robust platform for industry professionals to collaborate and exchange ideas, fostering the sharing of technical insights and the integration of industry resources. Through in-depth technical discussions and the unveiling of cutting-edge new products, the event further clarified the development direction for diamond-based thermal packaging materials and devices, playing a vital role in driving technological innovation and advancing the growth of this sector. We are confident that, with the collective efforts of all stakeholders, the diamond-based thermal packaging materials and devices industry will unlock even broader opportunities for future growth and prosperity.