Huanghe Whirlwind Joint Venture Company launches four new types of diamond products, striving to solve the problem of semiconductor heat dissipation

Recently, at the "Carbon Exploring the Future, Diamond Breaking Through Limits" seminar held in Xuchang, Henan, four new diamond products launched by Henan Qianyuan Xinzhuan Semiconductor Technology Co., Ltd. became the focus of the industry. These products are expected to provide innovative solutions to the heat dissipation problems in fields such as 5G/6G and AI chips, helping China's high-end semiconductor material field transition from "following" to "leading". Diamond At the seminar on diamond-like heat dissipation packaging materials and devices held recently in Xuchang, Henan, four new diamond products launched by Henan Qianyuan Xinzhuan Semiconductor Technology Co., Ltd. became the industry focus. These products are expected to offer innovative solutions to heat dissipation challenges in fields such as 5G/6G and AI chips, helping China's high-end semiconductor materials sector transition from 'follower' to 'leader'.

       I. Four New Products Directly Address High-End Heat Dissipation Needs

The four product categories released by Henan Qianyuan Xinzhuan Semiconductor Technology Co., Ltd. are: ultra-thin diamond heat sinks, ultra-thin diamond film devices, single/polycrystalline diamond packaging substrates, and modified diamond powder and diamond-copper composite materials. These products precisely target the high-end heat dissipation needs of strategic emerging industries such as artificial intelligence, new energy, optical communication, and data centers, with broad market prospects.

     II. Strong Joint Venture Background, Remarkable R&D Achievements

Henan Qianyuan Xinzhuan Semiconductor Technology Co., Ltd. was jointly established by Huanghe Xuanfeng and Suzhou Bozhi Jindi Technology Co., Ltd. Huanghe Xuanfeng, as the only domestic company with a full industrial chain in the superhard materials industry, has achieved fruitful results in diamond material R&D. superhard materials In May 2023, Huanghe Xuanfeng launched the "Development of CVD polycrystalline diamond films for high-end application scenarios" project, successfully developing a 2-inch diameter CVD polycrystalline diamond heat sink. On November 11, 2024, Huanghe Xuanfeng and Xiamen University's Saben Dong Micrometer and Nanometer Science and Technology Research Institute established a joint laboratory for integrated circuit thermal control, conducting innovative research on integrated heat dissipation applications based on diamond materials to address the heat dissipation challenges of chips in 5G/6G, AI, and phased array radar fields. In early 2025, Huanghe Xuanfeng successfully grew semiconductor 5～30μm ultra-thin 6～8 inch polycrystalline diamond wafer heat sink materials. The material thickness is 0.02～1mm, with good uniformity and thermal conductivity of 1000～2200W/m•K. Key indicators meet customer requirements and mass production standards. Currently, it is actively connecting with downstream high-end application fields and developing the market.

Combining Bozhi Jindi's technical experience in high-power chip packaging devices, especially advanced surface modification technology, Huanghe Xuanfeng jointly promotes the R&D and industrialization of several new generations of ultra-high-performance diamond heat dissipation materials and devices, further improving the heat transfer and electrical performance of packaging devices and leading the international development direction of ultra-high-power heat dissipation materials and devices.

        III. Experts and Scholars Gather to Explore Cutting-Edge Achievements

At the seminar, experts and scholars from universities such as Xi'an Jiaotong University and University of Science and Technology Beijing shared their latest research findings. Dr. Wang Yanfeng, associate professor at Xi'an Jiaotong University, gave a report on "Single Crystal Diamond Ultra-Wide Bandgap Semiconductor", combining research on band gap, breakdown field strength, mobility, dielectric constant, and thermal conductivity of diamond semiconductors. Dr. Zhang Yongjian from the National Key Laboratory of New Metal Materials at University of Science and Technology Beijing gave a report on "Interface Control and Preparation of High Thermal Conductivity Copper/Diamond Composite Materials". Mr. Nie Yuan, senior engineer at Chengdu Hongke Electronic Technology Co., Ltd., gave a report on "Thermal Applications and Market Research of Diamond". Dr. Ma Shenglin, associate director, professor, and doctoral supervisor of the Department of Mechanical and Electrical Engineering at Xiamen University, gave a report on "Diamond in High-Computing Power AI Chip Packaging Heat Dissipation Applications", detailing the integrated application design of diamond in high-computing power AI chip packaging heat dissipation and research progress in diamond jet microfluidic heat dissipation.

IV. Looking to the Future, Leading High-Quality Industrial Development

Pang Wenlong, vice chairman and general manager of Huanghe Xuanfeng, stated that Huanghe Xuanfeng will take this seminar as an opportunity to strengthen cooperation with multiple parties and continue to promote the research and development of polycrystalline diamond wafers. The focus will be on breakthroughs in the preparation technology of 12-inch polycrystalline diamond wafer heat sink materials and the development of large-size colorless polycrystalline diamond wafers for applications in high-end fields such as optical windows. Driven by technological breakthroughs, Huanghe Xuanfeng will lead high-quality industrial development and provide world-leading heat dissipation solutions for China's semiconductor industry.